In a move that signals a deeper alignment between design automation and semiconductor manufacturing, Siemens Digital Industries Software and Intel Foundry Services (IFS) have jointly announced the certification of Siemens’ EDA tools for Intel’s advanced nodes—including 16nm and the next-generation Intel 18A process.
For teams involved in system-on-chip (SoC) development, packaging innovation, or semiconductor integration, this collaboration isn’t just another announcement—it’s a milestone that may reshape toolchains and process integration across the industry.
Why This Matters to Design and Manufacturing Teams
With Siemens’ Calibre® nmPlatform and Solido™ Simulation Suite now certified for Intel’s nodes, design engineers can execute complex physical verification and variation-aware simulation tasks with full confidence in compatibility and performance. The certification ensures tools are optimized for Intel’s process design kits (PDKs), reducing risk in tape-out timelines and silicon realization.
From a production standpoint, such tool certifications are essential. They create verified pathways from design to manufacturing, minimizing downstream iterations and optimizing fabrication readiness. This is particularly critical for companies working with sensitive or high-reliability components in sectors such as aerospace, automotive, and industrial IoT.
Implications for Advanced Packaging
One of the standout elements of this collaboration is the support for Intel’s Embedded Multi-die Interconnect Bridge (EMIB) technology—a key enabler for 3D ICs and heterogeneous integration. Combined with Siemens’ packaging-aware design flows, this opens the door for denser, faster, and more energy-efficient designs.
For engineering teams exploring chiplet architectures, multi-die systems, or stacked configurations, the intersection of foundry-certified tools and advanced interconnect technology offers not just technical feasibility, but a validated route to production.
Alignment with IOG’s Perspective
At IOG, we closely follow the integration between design environments and real-world manufacturing conditions. Certified workflows—especially across multiple die and advanced nodes—support a more traceable, monitorable, and controllable supply chain. These developments are aligned with our core mission: increasing visibility and resilience across complex manufacturing and logistics ecosystems.
This Siemens–IFS announcement is more than a tech headline—it’s a signal of where the industry is heading: toward tighter vertical integration, enhanced reliability, and tool-process co-optimization.